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New High-Efficiency Thermal Management Materials
Effectively Transfer Heat from Components to Heat Sinks
Thermal Management Materials
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Thermal Management Materials introduction
Our company is dedicated to researching and providing comprehensive thermal management solutions for electronic products. We offer both conductive and insulating thermal management materials. Conductive materials excel in heat transfer, ensuring reliability across various environments, and support high integration in compact devices. Insulating materials block heat flow, safeguarding sensitive electronics and applications from extreme temperatures.
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01. Graphite Copper Mesh

By leveraging the high thermal conductivity of graphite, a special process and material are used to laminate graphite with a copper mesh, enhancing and addressing the issues of low vertical thermal conductivity and fragility of graphite.


Application in Electric Vehicles:

In tests, the application in electric vehicles resulted in a temperature rise of 11-12°C and a temperature difference of 2.5-3°C.


Key Features:

High vertical and planar thermal conductivity (up to 450W/(m·K))

Customizable thickness, with the thinnest option being 0.055mm

Low density, approximately 2-2.5g/cm³

Flexible and bendable

Can be converted into a heating strip at low temperatures

Cost-effective

02. Aerogel insulation film

The aerogel insulation film is an innovative nanomaterial designed as a thin film for thermal insulation. It effectively addresses the challenges of heat distribution in the confined spaces of consumer electronics and provides thermal protection for components with low heat tolerance. This material enhances product performance and longevity while also improving user comfort.


Key Features:

Low Thermal Conductivity

Thin Film Design

Excellent Insulation Properties

Versatile Application: Can be combined with heat dissipation films to offer various thermal management solutions

ROHS Compliance: Environmentally friendly

Product Specifications

Details

Thickness

50μm-500μm

Thermal Conductivity

0.018~0.022 W/(m•K)

Temperature Resistance Range

-40°C to 150°C

Long-term Usage Temperature

120°C

Flame Retardancy

UL94 V-0

Dielectric Strength

≥4 KV/mm

Volume Resistivity

≥1.0×10¹³ Ω•cm

Form Factor

Roll, customizable to specific dimensions

03. Thermal conductive silicone pad

Our thermal silicone pads are designed to fill gaps, facilitating heat transfer between heat-generating and heat-dissipating components. They also provide insulation, vibration damping, and sealing, making them ideal for supporting the miniaturization and ultra-thin design requirements of modern devices. These pads offer both high performance and usability, meeting the rigorous demands of advanced applications.


Advantages:

Double-sided Adhesion: Provides secure attachment to surfaces

Soft and Insulating: Offers excellent electrical insulation and flexibility

Vibration Damping and Noise Reduction: Minimizes mechanical vibrations and noise

Good Compressibility: Ensures tight fitting and effective heat transfer

Stable and Efficient: Delivers consistent thermal performance across a range of applications

Adjustable Thermal Conductivity: Customizable to meet specific heat management needs

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Product Specifications

Value

Thermal Conductivity

2~12 W/(m•K)

Density

1.60~3.6 g/cm³

Surface Drying Time

≤20 minutes at 25°C

Full Cure Time

3-7 days at 25°C

Elongation

≥200%

Hardness

Shore A 8~60

Peel Strength

>5 N/mm

Operating Temperature Range

-60°C to 280°C

Volume Resistivity

>2.0×10¹⁰ Ω/cm³

Dielectric Strength

>10 KV/mm

Flame Retardancy

UL94 V-0

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Expert In Custom Solutions For More Efficient Electromagnetic Shielding Components
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Mob:+86 180 6802 3605
Tel: +86 0512-66563293-8010
Address: 88 Dongxin Road, Xukou Town, Wuzhong District, Suzhou City, Jiangsu Province, China

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