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Aluminum Insulation Foil ≥1200 by - Konlida 1

Aluminum Insulation Foil ≥1200 by - Konlida 2

Aluminum Insulation Foil ≥1200 by - Konlida 3

Aluminum Insulation Foil ≥1200 by - Konlida 4

Aluminum Insulation Foil ≥1200 by - Konlida 5

Aluminum Insulation Foil ≥1200 by - Konlida 6

Aluminum Insulation Foil ≥1200 by - Konlida 7

Aluminum Insulation Foil ≥1200 by - Konlida

Model Number:

Graphite copper plating

Brand Name:

Konlida

Inquiry

Initial Adhesion Force(g/inch)

≥1200

Thickness(mm)

Min.0.025(Customizable)

Color

Silver gray/Gold

Product Overview

The Aluminum Insulation Foil is a conductive polyimide film commonly used in the electronics industry for EMI shielding and grounding effects.

Aluminum Insulation Foil ≥1200 by - Konlida 8

Aluminum Insulation Foil ≥1200 by - Konlida 9

Product Features

Extremely low surface resistance

High-temperature resistance (-40~280℃)

Thin thickness (0.016mm)

Excellent shielding effectiveness (above 75dB)

Conforms to RoHS standards

Product Value

The product provides a reliable solution for EMI shielding and grounding in electronic devices, ensuring high performance and durability.

Aluminum Insulation Foil ≥1200 by - Konlida 10

Aluminum Insulation Foil ≥1200 by - Konlida 11

Product Advantages

Versatile application in game machines, telephones, electronic watches, calculators, etc.

Different plating options for specific characteristics

Meets fire rating and environmental requirements

Excellent adhesion force and retention

Application Scenarios

The Aluminum Insulation Foil is widely used in various products with liquid crystal displays and circuit boards for effective EMI shielding and grounding.

Aluminum Insulation Foil ≥1200 by - Konlida 12

we welcome custom designs and ideas and is able to cater to the specific requirements. for more information, please visit the website or contact us directly with questions or inquiries.