Konlida Polyimide Film High Temp Resistant PI Film Electrical Insulation
Conductive polyimide film is a common conductive material, mainly used in the electronics industry as a covering layer for foam or silicone gaskets to provide electromagnetic shielding and grounding. It consists primarily of polyimide (PI) and a metal coating, which can be nickel (silver-gray), gold (golden), tin (silver), or copper (reddish-purple). Coating thicknesses typically include 0.018mm and 0.025mm.
FEATURES
1. Extremely low surface resistance.
2. High temperature resistance, usable from -40°C to 280°C.
3. Thickness as thin as 0.018mm.
4. Excellent shielding performance (over 75dB between 10MHz-10GHz).
5. Different coatings provide unique properties: nickel and gold plating resist oxidation and corrosion, with gold plating offering surface resistance below 0.02Ω/sq.
6. Compliant with ROHS standards.
APPLICATION
STORAGE CONDITIONS
Best storage conditions: 23±2℃ 65± 5% RH indoor environment, 1 year of quality guarantee period after manufacturing.
Shielding effectiveness curve
SPECIFICATION
| Key Attributes | Performance Parameter | Test Standard |
| Coating | Cu-Ni（Au）/(Si) | - |
| Color | Silver gray/Gold | Visual |
| Thickness（mm） | Min.0.025（Customizable） | FZ/T01003-1991 |
| Surface Resistance (Ω/inch) | ≤0.05 | ASTM F390 |
| Vertical Resistance (Ω/inch) | ≤0.03 | ASTM F390 |
| Shielding Effectiveness (db) | 70-100(10 MHz-3 GHz) | SJ20524-1995 |
| Initial Adhesion Force（g/inch） | ≥1200 | GB/T 2792-1998 |
| Retention Adhesion Force（Min/inch） | 1000 | GB/T 4851 |
| Temperature Resistance（℃） | -40~280 ℃ | GB/T 32368-2015 |
| Fire Rating | UL94 (HF-1) | UL94 |
| ROSH requirements | Free of halogen and heavy metals | IEC62321 |
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