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Electromagnetic Shielding
Thermal Management
Precision Die Cutting
Metal & Non-Metal Precision Parts
Beryllium copper shrapnel can be used in a wide range of electronic devices with EMI / RFI or ESD. It is used for shielding of various shielding rooms / cover plates / printed boards / integrated circuits, etc. Beryllium copper shrapnel can work well in a variety of environments, and a variety of coatings can be selected to ensure electrochemical compatibility with other contact surfaces. It doesn't burn and isn't affected by radiation or UV. For these reasons, designers use beryllium copper shrapnel to shield EMI in Computing Center, 5G base stations and other electronic equipment.Konlida beryllium copper shrapnel is a combination of beryllium copper alloy shrapnel and electromagnetic compatibility shielding technology. It can be used to seal the gap between two contact surfaces while providing a very high shielding effect. You can make many different choices for the metal plating process, which ensures compatibility with any contact surface.
Beryllium copper shrapnel has high relaxation resistance and excellent wear resistance. It is also burn resistant and unaffected by radiation. With all these advantages Konlida beryllium copper shrapnel becomes the ideal emc shielding material for computer and electrical design engineers. Konlida uses beryllium copper material: American Brushwellman imported beryllium copper material, which belongs to high beryllium material (containing beryllium: 1.8-2.0%); there are 2 kinds of materials before heat treatment: C17200-1/4H and C17200-1/2H, Corresponding to the original material hardness: 110-180HV and 175-230HV. Mainly provides 2 choices for stamping materials. After heat treatment, the minimum hardness is above 373HV. In summary: For the end customer, choose 1/4H and 1/2H It has no effect.
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