What are Thermal Management Products?

Thermal management controls a system's temperature through technology based on heat transfer and thermodynamics concepts. Thermal management implies practicing all processes and methods to decrease or increase the temperature of a targeted system.

Thermal management products are the physical components and materials used to control a system's temperature and the tools and materials employed to cool down a device or system. The rapid growth of technology across various sectors, particularly in electronics, necessitates using advanced thermal management products. These products ensure electronic devices' reliable and efficient operation, from smartphones and laptops to high-performance servers and data centers.

Understanding the Mechanism Behind Thermal Management Products

Thermal Management Operates Through Three Key Mechanisms: Here's a Detailed Overview of How They Work:

●  Conduction

Conduction is a crucial heat transfer mechanism in thermal management. It involves directly transferring heat energy through the physical contact between objects. When two objects with different temperatures touch, heat flows from the hotter object to the colder one until they reach thermal equilibrium.

● Convection

Convection is a vital heat transfer mechanism in thermal management. It involves the transfer of heat through the movement of fluids, such as liquids or gases. When a fluid is heated, it expands, becomes less dense, and rises. As it grows, it carries heat away from the heat source. Cooler, denser fluid replaces the warmer fluid, creating a continuous movement cycle.

● Radiation

Radiation is another significant heat transfer mechanism in thermal management. Unlike conduction and convection, which require a physical medium for heat transfer, radiation can occur through a vacuum. It involves emitting electromagnetic waves, such as infrared radiation, from a heat source. These waves travel through space and are absorbed by other objects, causing them to heat up. In thermal management, radiation is often used with other cooling methods to enhance heat dissipation.

Kolinda: Offering high-quality thermal management Products

Konlida has established itself as a leader in the thermal management industry through the in-house development and production of innovative and award-winning thermal materials. These materials, designed to effectively manage heat dissipation within electronic devices, have found widespread adoption across the consumer electronics sector. With a strong commitment to research and development, Konlida offers a comprehensive range of thermal management solutions, encompassing conductive and insulating materials. This comprehensive approach allows Konlida to address the diverse thermal challenges faced by electronic manufacturers, enabling them to optimize device performance, enhance reliability, and extend product lifespans.

● Thermal Management Products offered by Kolinda:

Kolinda offers a good range of high-quality thermal management products. The specifications, key features, and application of which are given below:

➢ Aerogel Insulation Film

Specification:

Aerogel insulation film is a high-performance thermal insulation material primarily utilized for heat preservation and insulation. It is comprised mainly of silica aerogel and typically exhibits a white appearance. It boasts an ultrathin profile, ranging from 0.05 to 0.3 millimeters in thickness.

Features:

1. Ultra-low thermal conductivity, good heat insulation effect

2. The thinnest thickness can reach 0.05 mm

3. Ultra-lightweight material with a density as low as 0.003 g/cm3

4. Has good insulation properties

5. Has good flame retardant properties

6. Meet RoHS standards

Application:

1. Mobile Phone, PDA, Note-PC, Digital camera

2. LCD, PDP Set-top Box

➢ Copper Plated Graphite

Specifications:

Copper Plated Graphite is a thermally conductive material primarily characterized by its high thermal conductivity and dual functionality as an EMI shielding material. It typically consists of artificial graphite with an electroplated copper layer, resulting in a distinct appearance: a greyish-black graphite side and a purplish-red copper side. The material exhibits a relatively thin profile, generally ranging from 0.027 to 0.07 millimeters in thickness.

Features:

1. Has a high level of thermal conductivity

2. The thickness can be as thin as 0.027 mm

3. The surface resistance of the copper-plated side is very low, ≤ 0.01 Ω, and the overall volume resistance of the material is small

4. Excellent EMI shielding effectiveness

5. Graphite side has excellent corrosion resistance and oxidation resistance

6. Meet RoHS standards

Application:

1. Use for equipment, ESD, EMI, EMC field, etc

2. Mobile Phone, PDA, Note-PC, Digital camera

3. LCD, PDP, Set-top Box

➢ Thermal Conductive Silicone Pad

Specification:

Thermal conductive silicone pads are synthesized from silica gel, incorporating metal oxides and other additives to create a thermally conductive medium. These pads fill gaps, conduct heat, and reduce contact thermal resistance. Additionally, they offer insulation, shock absorption, and sealing capabilities. Their thickness versatility accommodates modern equipment's miniaturization and ultra-thin design requirements.

Features:

1. Soft, compressible, good thermal conductivity and insulation, versatile thickness, suitable for gap filling, easy to use and maintain.

2. Reduces contact thermal resistance and fills gaps between heat source and radiator.

3. Air hinders heat transfer; silicone gaskets remove air from contact surfaces.

Application:

1. The mainboard of electronic products; inside the motor,

2. Electrical, automotive, mechanical, computer, laptop, DVD, VCD

3. Any equipment that needs to fill the thermal gap and install a heat dissipation module.

➢ Graphite Copper Mesh

Specification:

Graphite copper mesh, or graphite composite copper mesh, primarily serves as a heat-conducting material, facilitating efficient heat conduction and dissipation away from the heating unit. It can also be employed as an electrode material. This composite material typically consists of natural graphite and copper mesh arranged in a graphite-copper mesh-graphite or graphite-copper mesh configuration.

Features:

1. Has a high level of thermal conductivity

2. Has specific mechanical strength

3. The copper mesh side has low surface resistance, and the overall volume resistance of the material is small

4. Have particular EMI shielding effectiveness

5. Graphite-copper mesh-graphite structure material has excellent surface corrosion resistance and oxidation resistance

6. Meet RoHS standards

Application:

1. Use for equipment, ESD, EMI, EMC field, etc

2. Mobile Phone, PDA, Note-PC, Digital camera

3. LCD, PDP, Set-top Box

➢ Graphite Thermal Conductive Foam Pad

Specification:

The graphite thermal conductive foam pad comprises a heat-conducting foam with a cubical structure. Encasing the heat-conducting foam, a layer of graphite patch is affixed using an adhesive material. This graphite patch, composed of a single material, is folded and secured over the heat-conducting foam.

Features:

1. High thermal conductivity for products with thick thickness requirements

2. Good compressibility

3. Strong endurance

4. The arrangement can form large-size products

5. Meet RoHS standards

Application:

1. Replace the silicone heat conducting sheet

2. Transfer heat from the heat source to the radiator

3. Application of heat transfer inside the shield

4. Other heat conduction applications

➢  VC Soaking Plate

Specification:

The VC soaking plate, an abbreviation for Vapor-Chamber soaking plate, represents a cutting-edge, high-efficiency thermal conductive material. Its innovative heat transfer mechanism leverages the rapid phase change of a working fluid to achieve exceptional thermal performance.

The thickness of VC soaking plates can vary considerably depending on the specific application requirements. For instance, computer radiators commonly utilize VC soaking plates with thicknesses ranging from 3.5 to 4.2 millimeters. In contrast, ultra-thin electronic devices and mobile phones demand significantly thinner solutions, with VC-soaking plate thicknesses typically around 0.3 millimeters.

Features:

1. Excellent temperature uniformity performance

2. Excellent thermal conductivity: the thermal conductivity along the conduction direction can reach 5000~100,000W/(m*K)

3. Ultra-thin VC soaking plate can be prepared for an ultra-thin environment; the thinnest can reach 0.25mm

4. Excellent EMI shielding effectiveness

5. Meet RoHS standards

Application:

1. Use for equipment, ESD, EMI, EMC shield field

2. Mobile Phone, PDA, Note-PC, Digital camera

3. LCD, PDP, Set-top Box

Comparison Table

Final Thoughts

Konlida excels in developing and producing innovative thermal management products, addressing the critical need for effective heat dissipation in today's advanced electronics. Their comprehensive portfolio encompasses a wide range of high-performance materials, including both conductive and insulating solutions. This commitment to providing cutting-edge thermal management solutions empowers electronics manufacturers to optimize device performance, enhance reliability, and extend product lifespans, ultimately delivering superior products.