Application Case of Konlida's Conductive Foam Gaskets in Consumer Electronics

With the rapid advancement of technology, the consumer electronics industry demands increasingly higher performance standards. In particular, traditional SMT conductive elastic gaskets have become inadequate for specific applications in electromagnetic shielding and conductive connectivity. Leveraging profound material research capabilities, Konlida has successfully developed a low-pressure, high-resilience conductive foam, bringing a revolutionary solution to the consumer electronics industry.

Product Introduction:

Konlida's low-pressure, high-resilience conductive foam is an innovative material designed specifically for SMT conductive elastic gaskets. By precisely improving the pore structure of the elastic core, this product achieves a perfect combination of low rebound force and high stability. Additionally, it boasts excellent temperature resistance and low electrical resistance, ensuring stable and long-lasting performance in complex environments.

Application Case:

In the consumer electronics industry, PCBs (Printed Circuit Boards) are central components of electronic products, and electromagnetic shielding and conductive connectivity are indispensable in PCB design. Traditional SMT conductive elastic gaskets can meet basic electromagnetic shielding and conductive needs but often suffer performance issues in special environments such as high temperatures and strong vibrations.

Konlida's low-pressure, high-resilience conductive foam is designed to address these issues. It has been widely used in the PCB design of a smartphone manufacturer. While pursuing thinner and lighter products, the manufacturer places high demands on electromagnetic shielding and conductive connectivity. Traditional SMT conductive elastic gaskets, due to their high rebound force, tend to deform after prolonged use, reducing their shielding effectiveness. Konlida's conductive foam, through its unique structural design, balances low rebound force with high stability, maintaining reliable performance even during extended use and ensuring overall product quality.

Furthermore, Konlida's conductive foam exhibits excellent temperature resistance. In the usage of smartphones and other consumer electronics, internal component heat can pose a high-temperature challenge to PCBs. Konlida's foam can operate normally within a wide temperature range of -40℃ to +150℃, ensuring product stability in various environments.

Customer Feedback:

Konlida's low-pressure, high-resilience conductive foam gained highly praise for its performance. Compared to traditional SMT conductive elastic gaskets, Konlida's product excels in rebound force, stability, temperature resistance, and conductive connectivity. Even in harsh environments such as high temperatures and strong vibrations, Konlida's foam maintains stable performance, providing robust support for overall product quality.

Conclusion:

Konlida's low-pressure, high-resilience conductive foam has gained widespread application in the consumer electronics industry due to its excellent performance and broad applicability. In the future, Konlida will continue to innovate and develop, providing higher-quality products and services to more industries.