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Thermal Conductive Silicone Pad

Thermal Management Materials

The thermal conductive silicone pad is a kind of thermally conductive medium material synthesized by a special process with silica gel as the base material and adding various auxiliary materials such as metal oxides. It is used to fill the gap, conduct heat and reduce the contact thermal resistance. At the same time, it has the functions of insulation, shock absorption and sealing. It can meet the design requirements of miniaturization and ultra-thin of the equipment and has a wide range of thicknesses for application.

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Features:
1. The material is soft, has good compression performance, good thermal conductivity and insulation performance, and it has a wide range of thickness for application. It is suitable for filling gaps. It has natural viscosity on both sides and has strong operability and maintainability;
2. It can reduce the contact thermal resistance between the heat source surface and the contact surface of the radiator, and fill the gap of the contact surface well;
3. Because air is a poor conductor of heat, it will seriously hinder the heat transfer between the contact surfaces, and the installation of thermal conductive silicone gasket between the heat source and radiator can squeeze the air out of the contact surface;

Applications:
1.The mainboard of electronic products; inside the motor,
2.Electrical, automotive, mechanical, computer, laptop, DVD, VCD
3.And any equipment that needs to fill the thermal gap and install a heat dissipation module.

Storage conditions:
Best storage conditions: 23±2℃ 65± 5% RH indoor environment, 1 year of quality guarantee period after manufacturing



Specification:

Item Unit Specification Test standard
Color / Light grey Visual
Density g/cm3 3.55 ASTM D792
Thermal conductivity W/m.K 3~8 ASTM D5470
Thickness mm 0.5-3.0 ASTM D374
Hardness Shore A 65 ASTM D2240
Fire Rating / V-0 UL94
Volume Resistance Ω.cm ≥1.0×10^13 GB/T1410
Temperature Resistance -50~200 /
Breakdown voltage KV ≥10 ASTM D149

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